• Your shopping cart is empty!

  • JEDEC JEP167

JEDEC JEP167

Characterization of Interfacial Adhesion in Semiconductor Packages

JEDEC Solid State Technology Association, 04/01/2013

Publisher: JEDEC

File Format: PDF

$36.00$72.00


Published:01/04/2013

Pages:30

File Size:1 file , 280 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

More JEDEC standard pdf

JEDEC JESD 24-11 (R2002)

JEDEC JESD 24-11 (R2002)

ADDENDUM No. 11 to JESD24 - POWER MOSFET EQUIVALENT SERIES GATE RESISTANCE TEST METHOD

$24.00 $48.00

JEDEC JEP128

JEDEC JEP128

GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING

$25.00 $51.00

JEDEC JESD8-8

JEDEC JESD8-8

ADDENDUM No. 8 to JESD8 - STUB SERIES TERMINATED LOGIC FOR 3.3 VOLTS (SSTL_3) A 3.3 V VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS

$29.00 $59.00

JEDEC JESD51-3

JEDEC JESD51-3

LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES

$26.00 $53.00