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  • JEDEC JESD22-B102E

JEDEC JESD22-B102E

SOLDERABILITY

JEDEC Solid State Technology Association, 10/01/2007

Publisher: JEDEC

File Format: PDF

$33.00$67.00


Published:01/10/2007

Pages:25

File Size:1 file , 120 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages. The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead (Pb) containing or Pb-free solder for the attachment.

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