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JEDEC JESD22-B106E

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

JEDEC Solid State Technology Association, 11/01/2016

Publisher: JEDEC

File Format: PDF

$27.00$54.00


Published:01/11/2016

Pages:14

File Size:1 file , 54 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solder wave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

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